Reference number
Ïã¸ÛÁùºÏ²Ê¿ª½± 14701:2011
Ïã¸ÛÁùºÏ²Ê¿ª½± 14701:2011
Surface chemical analysis — X-ray photoelectron spectroscopy — Measurement of silicon oxide thickness
Edition 1
2011-08
Withdrawn
Ïã¸ÛÁùºÏ²Ê¿ª½± 14701:2011
54929
Withdrawn (Edition 1, 2011)

Abstract

Ïã¸ÛÁùºÏ²Ê¿ª½± 14701:2011 specifies several methods for measuring the oxide thickness at the surfaces of (100) and (111) silicon wafers as an equivalent thickness of silicon dioxide when measured using X-ray photoelectron spectroscopy. It is only applicable to flat, polished specimens and for instruments that incorporate an Al or Mg X-ray source, a specimen stage that permits defined photoelectron emission angles and a spectrometer with an input lens that can be restricted to less than a 6° cone semi-angle. For thermal oxides in the range 1 nm to 8 nm thickness, using the best method described in the standard, uncertainties, at a 95 % confidence level, could typically be around 2 % and around 1 % at optimum. A simpler method is also given with slightly poorer, but often adequate, uncertainties.

General information

Got a question?

Check out our Help and Support

Check out our FAQs

Customer care
+41 22 749 08 88

Opening hours:
Monday to Friday - 09:00-12:00, 14:00-17:00 (UTC+1)